Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184151 | Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices | Ng Kok Siang | 2015-11-10 |
WL
Wong Wai Loon
Overall (All Time): #3,079,083 of 4,157,543Top 75%
1
Patents All Time