Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7395719 | Preformed sensor housings and methods to produce thin metal diaphragms | Marcos A. Nassar | 2008-07-08 |
| 6429028 | Process to remove semiconductor chips from a plastic package | Philip B. Young, Douglas M. Young, Gary Bivins, William S. Ditto, Huong Kim Lam | 2002-08-06 |