JT

John Trezza

CL Cufer Asset Ltd. L.L.C.: 28 patents #1 of 17Top 6%
XA Xanoptix: 25 patents #1 of 14Top 8%
TE Teraconnect: 18 patents #1 of 12Top 9%
CW Cubic Wafer: 5 patents #1 of 7Top 15%
SI Sensors Incorporated: 3 patents #24 of 100Top 25%
IN Intel: 3 patents #10,349 of 30,777Top 35%
Stanford University: 1 patents #2,251 of 5,197Top 45%
📍 Nashua, NH: #3 of 1,592 inventorsTop 1%
🗺 New Hampshire: #33 of 12,181 inventorsTop 1%
Overall (All Time): #12,478 of 4,157,543Top 1%
108
Patents All Time

Issued Patents All Time

Showing 26–50 of 108 patents

Patent #TitleCo-InventorsDate
7946331 Pin-type chip tooling Ross Frushour 2011-05-24
7942182 Rigid-backed, membrane-based chip tooling Ross Frushour 2011-05-17
7932584 Stacked chip-based system and method 2011-04-26
7919870 Coaxial through chip connection 2011-04-05
7884483 Chip connector John Callahan, Gregory Dudoff 2011-02-08
7871927 Wafer via formation 2011-01-18
7851348 Routingless chip architecture Abhay Misra 2010-12-14
7850060 Heat cycle-able connection 2010-12-14
7847412 Isolating chip-to-chip contact 2010-12-07
7838997 Remote chip attachment 2010-11-23
7831151 Redundant optical device array 2010-11-09
7808111 Processed wafer via 2010-10-05
7803693 Bowed wafer hybridization compensation 2010-09-28
7786592 Chip capacitive coupling 2010-08-31
7785987 Isolating chip-to-chip contact 2010-08-31
7785931 Chip-based thermo-stack 2010-08-31
7781886 Electronic chip contact structure John Callahan, Gregory Dudoff 2010-08-24
7767493 Post & penetration interconnection John Callahan, Gregory Dudoff 2010-08-03
7748116 Mobile binding in an electronic connection 2010-07-06
7705632 Variable off-chip drive Theodore J. (Ted) Wyman 2010-04-27
7705613 Sensitivity capacitive sensor Abhay Misra 2010-04-27
7687400 Side stacking apparatus and method 2010-03-30
7687397 Front-end processed wafer having through-chip connections 2010-03-30
7670874 Plated pillar package formation 2010-03-02
7659202 Triaxial through-chip connection 2010-02-09