Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5358826 | Method of fabricating metallized chip carries from wafer-shaped substrates | Richard R. Steitz, Eugene F. Neumann, Melvin C. August, Stephen Nelson | 1994-10-25 |
| H1153 | Non-metallized chip carrier | Melvin C. August, Arthur J. Hebert, Eugene F. Neumann, Richard R. Steitz | 1993-03-02 |
| 5182420 | Method of fabricating metallized chip carriers from wafer-shaped substrates | Richard R. Steitz, Eugene F. Neumann, Melvin C. August, Stephen Nelson | 1993-01-26 |
| 5127570 | Flexible automated bonding method and apparatus | Richard R. Steitz, Melvin C. August, Deanna M. Dowdle, Dean B. Dudley, Stephen Nelson +2 more | 1992-07-07 |