Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551650 | Dip formation of flip-chip solder bumps | Alain R. E. Carre | 2003-04-22 |
| 6257366 | Exhaust device for a turbine engine | Yvette Gertrude Roman, Everhardus Gerretsen | 2001-07-10 |