FS

Floyd E. Stumpff

CI Corning Incorporated: 5 patents #983 of 3,867Top 30%
Overall (All Time): #1,051,326 of 4,157,543Top 30%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5964020 Bonded pin extrusion die and method Harry A. Kragle 1999-10-12
5761787 Method of making bonded pin extrusion die Harry A. Kragle 1998-06-09
5702659 Honeycomb extrusion die and methods Harry A. Kragle, David Robertson Treacy, Jr. 1997-12-30
5256054 Method and apparatus for forming a uniform skin on a cellular substrate Joseph F. Cocchetto, Harry A. Kragle 1993-10-26
5219509 Method for forming a uniform skin on a cellular substrate Joseph F. Cocchetto, Harry A. Kragle 1993-06-15