Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11470736 | Potted electronic module with improved adhesion of potting compound | Henryk Frenzel, Dietmar Huber, Jakob Schillinger, Karl-Heinz Scherf, Georg Weber | 2022-10-11 |