JM

Joerg Mahrle

CG Conti Temic Microelectronic Gmbh: 1 patents #235 of 606Top 40%
📍 Göppingen, DE: #93 of 174 inventorsTop 55%
Overall (All Time): #3,480,062 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6740982 Microelectronic package with an attachment layer including spacer elements Klaus Sauter 2004-05-25