Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6320258 | Semiconductor device having alternating electrically insulative coated leads | Rosario Pogliese | 2001-11-20 |
| 5888889 | Integrated structure pad assembly for lead bonding | Ferruccio Frisina | 1999-03-30 |
| 5766985 | Process for encapsulating a semiconductor device having a heat sink | Rosario Pogliese | 1998-06-16 |
| 5592026 | Integrated structure pad assembly for lead bonding | Ferruccio Frisina | 1997-01-07 |
| 5514913 | Resin-encapsulated semiconductor device having improved adhesion | Rosario Pogliese | 1996-05-07 |