Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5197185 | Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques | Dirk D. McCoy | 1993-03-30 |
| 5078063 | Precision mechanical squeegee holding assembly | Dirk D. McCoy | 1992-01-07 |