Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309269 | Method for producing a solder bump on a substrate surface | Arnaud Garnier, Anthony De Luca, Daniel Mermin, Pierre Montmeat | 2022-04-19 |
LC
Laetitia Castagne
Overall (All Time): #2,650,085 of 4,157,543Top 65%
1
Patents All Time