Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5694482 | System and method for locating solder bumps on semiconductor chips or chip carriers | Ferevdoun Maali, George E. Hickok | 1997-12-02 |
| 4553192 | High density planar interconnected integrated circuit package | Robert Babuka, John L. Piechota | 1985-11-12 |