Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11511375 | Multi component solid solution high-entropy alloys | Jianxun Hu, Justin Brown, Peiyong Chen, Chanho Lee, Xuesong Fan +4 more | 2022-11-29 |
| 11339817 | Multi-material component and methods of making thereof | Jianxun Hu, Eric Walker, Zhenzhen Yu, Benjamin Schneiderman | 2022-05-24 |
| 11318566 | Multi-material component and methods of making thereof | Jianxun Hu, Eric Walker, Zhenzhen Yu, Benjamin Schneiderman | 2022-05-03 |