Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12403309 | Transcutaneous power and data communication link | — | 2025-09-02 |
| 10265533 | Implant heat protection | Werner Meskens, Oliver John Ridler | 2019-04-23 |
| 9936274 | System and method for providing a notification of device orientation | Werner Meskens | 2018-04-03 |
| 9642309 | Yield monitoring system | Christopher M. Schloesser | 2017-05-09 |
| 9351436 | Stud bump bonding in implantable medical devices | Milind Chandrakant Raje, Andrew Phillips Mudie, Gary Mark Ignacio | 2016-05-24 |