Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174596 | Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments | Weng-Lyang Wang, Shengmin Lin, Feng-Ke Hsiao | 2012-05-08 |
| 8058602 | Long-length industry camera image sensor for flat surface inspection application | Weng-Lyang Wang, Shengmin Lin, Feng-Ke Hsiao | 2011-11-15 |