Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365438 | Process for manufacturing semiconductor package and circuit board assembly | Yoshihiro Ishida, Kiyoshi Shimizu, Tetsuo Sato, Shinichi Nishikata, Atsushi Omura +1 more | 2002-04-02 |
| 6177731 | Semiconductor package | Yoshihiro Ishida, Taichi Miyazaki, Atsushi Omura, Tsutomu Ohara | 2001-01-23 |
| 5373316 | Video conference device with facsimile function | Iwao Ishinabe, Nobuyuki Matsuyama, Nobuyoshi Torii, Toshiaki Watanuki, Tomoki Kozono +3 more | 1994-12-13 |