Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5433822 | Method of manufacturing semiconductor device with copper core bumps | Seiichi Mimura, Junichiro Shimizu, Takayuki TAJIRI, Shingo Ichikawa, Hiroyuki Kaneko | 1995-07-18 |