Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5413838 | Both-side roughened copper foil with protection film | Keiji Azuma, Ryoichi Oguro | 1995-05-09 |
| 5320919 | Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same | Keiji Azuma, Ryoichi Oguro, Takashi Inada | 1994-06-14 |
| 5286330 | Method of producing copper-clad laminated board | Keiji Azuma, Ryoichi Oguro | 1994-02-15 |