Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7270732 | Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts | Chia-Hua Chang | 2007-09-18 |
| 7117577 | Method of fastening mold shell with mold seat without risk of causing mold shell to crack | Chia-Hua Chang, Ming-Jen Wang | 2006-10-10 |