Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7067068 | Method for preventing lead from dissolving from a lead-containing copper-based alloy | Sumiko Sanuki, Kunio Nakashima, Wataru Yago, Kenichi Ichida, Atsushi Yasukawa +1 more | 2006-06-27 |
| 5089354 | Wear-resistant, anti-seizing copper alloy composite materials | Kunio Nakashima, Takayuki Tanaka, Ken-ichi Ichida | 1992-02-18 |