PM

Phil P. Marcoux

CH Chipscale: 6 patents #5 of 7Top 75%
WP Wafer-Level Packaging Portfolio: 1 patents #5 of 6Top 85%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #656,211 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8053898 Connection for off-chip electrostatic discharge protection 2011-11-08
7858512 Semiconductor with bottom-side wrap-around flange contact 2010-12-28
6954130 Integrated passive components and package with posts James L. Young, Changsheng Chen 2005-10-11
6946734 Integrated passive components and package with posts James L. Young, Changsheng Chen 2005-09-20
6833986 Integrated passive components and package with posts James L. Young, Changsheng Chen 2004-12-21
6414585 Integrated passive components and package with posts James L. Young, Changsheng Chen 2002-07-02
6221751 Wafer fabrication of die-bottom contacts for electronic devices Changsheng Chen, Wendell B. Sander, James L. Young 2001-04-24
5910687 Wafer fabrication of die-bottom contacts for electronic devices Changsheng Chen, Wendell B. Sander, James L. Young 1999-06-08