Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8105881 | Method of fabricating chip package structure | Yong Qiao, Yan-Yi Wu | 2012-01-31 |
| 8088650 | Method of fabricating chip package | Yong Qiao, Yan-Yi Wu | 2012-01-03 |
| 8039946 | Chip package structure and fabricating method thereof | Hua Pan, Chih-Lung Huang | 2011-10-18 |
| 7741149 | Method of fabricating chip package structure | Yong Qiao, Yan-Yi Wu | 2010-06-22 |
| 7683462 | Chip package structure | Yong Qiao, Yan-Yi Wu | 2010-03-23 |