Yi-Chen Lien — 1 Patent at Chipbond Technology

Yi-Chen Lien has been granted 1 US patent while listed as an inventor at Chipbond Technology. All of these patents were granted in 2020. Yi-Chen Lien ranks #2,406,284 of 4,157,543 US inventors in our database (top 57.9%). Patent records list Yi-Chen Lien in Taichung, TW.

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
10880993	Circuit board having a predetermined punch area and sheet separated from the same	Yen-Ping Huang, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee	2020-12-29

Yi-Chen Lien — 1 Patent

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