Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9177830 | Substrate with bump structure and manufacturing method thereof | Fei Wu, Ching-Yi Huang, Chun-Te Lee | 2015-11-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9177830 | Substrate with bump structure and manufacturing method thereof | Fei Wu, Ching-Yi Huang, Chun-Te Lee | 2015-11-03 |