Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833810 | Method of fabricating isolation structures for CMOS image sensor chip scale packages | Tzu-Han Lin, Tzy-Ying Lin, Fang Liu | 2010-11-16 |
| 7824964 | Method for fabricating package structures for optoelectronic devices | Fang Liu | 2010-11-02 |
| 7679187 | Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof | Fang Liu | 2010-03-16 |
| 7569409 | Isolation structures for CMOS image sensor chip scale packages | Tzu-Han Lin, Tzy-Ying Lin, Fang Liu | 2009-08-04 |
| 7566944 | Package structure for optoelectronic device and fabrication method thereof | Fang Liu | 2009-07-28 |