Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667339 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Eun Jung Lee, Yoon Kok Park, Young Kyun Lee, Suk K. Chang | 2010-02-23 |
| 5428057 | New maleimide modified epoxy resin and a method for the preparation thereof | Tai Y. Nam | 1995-06-27 |
| 5266612 | Imide epoxy resin composition for sealing semiconductor elements | Ji Yeon Lee | 1993-11-30 |
| 5254605 | Imide epoxy resin composition for sealing semiconductor elements | Byung Wook Lee, Ji Yeon Lee | 1993-10-19 |
| 5210115 | Allyl magnesium halide modified epoxy resin composition | Tai Y. Nam | 1993-05-11 |
| 5189082 | Imide epoxy resins for sealing semiconductor elements | Tai Y. Nam | 1993-02-23 |