Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6706625 | Copper recess formation using chemical process for fabricating barrier cap for lines and vias | John Sudijono, Liu Wu Ping | 2004-03-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6706625 | Copper recess formation using chemical process for fabricating barrier cap for lines and vias | John Sudijono, Liu Wu Ping | 2004-03-16 |