Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417995 | Chip packaging structure and method for preparing the same, and method for packaging semiconductor structure | — | 2025-09-16 |
| 12191271 | Semiconductor structure comprising up-narrow and down-wide openings and forming method thereof | — | 2025-01-07 |
| 12176311 | Micro bump, method for forming micro bump, chip interconnection structure and chip interconnection method | — | 2024-12-24 |
| 12132022 | Semiconductor devices and preparation methods thereof | — | 2024-10-29 |
| 11978698 | Method for forming a semiconductor package structure | — | 2024-05-07 |