Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12206060 | Lead frame assembly and chip packaging device | — | 2025-01-21 |
| 12113001 | Lead frame assembly having a plurality of dicing holes | — | 2024-10-08 |
| 11495523 | Lead frame having a die pad with a plurality of grooves on an underside | — | 2022-11-08 |
| 10937728 | Preformed lead frame and lead frame package made from the same | — | 2021-03-02 |
| 10607926 | Preformed lead frame device | — | 2020-03-31 |
| 10600726 | Leadframe and method of making the same | — | 2020-03-24 |
| 10475730 | Preformed lead frame device and lead frame package including the same | — | 2019-11-12 |
| 10424694 | Light emitting device package | — | 2019-09-24 |
| 10424535 | Pre-molded leadframe device | — | 2019-09-24 |
| 10373886 | Preformed lead frame and lead frame packaged structure including the same | — | 2019-08-06 |
| 10217699 | Preformed lead frame | — | 2019-02-26 |
| 10068837 | Universal preformed lead frame device | — | 2018-09-04 |
| 9984980 | Molded lead frame device | — | 2018-05-29 |
| 9847279 | Composite lead frame structure | — | 2017-12-19 |
| 9799613 | Lead frame device | — | 2017-10-24 |
| 9082760 | Dual layered lead frame | — | 2015-07-14 |