Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631600 | Apparatus and method for securing components of an integrated circuit | Frank Jun, Paul Kennedy | 2023-04-18 |
| 11626342 | Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion | — | 2023-04-11 |
| 11367686 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2022-06-21 |
| 11367701 | Apparatus and method for securing substrates with varying coefficients of thermal expansion | — | 2022-06-21 |
| 11201137 | Systems and methods for powering an integrated circuit having multiple interconnected die | — | 2021-12-14 |
| 11145530 | System and method for alignment of an integrated circuit | Tim Botsford, Philip Ferolito, Paul Kennedy | 2021-10-12 |
| 10971401 | Systems and methods for precision fabrication of an orifice within an integrated circuit | — | 2021-04-06 |
| 10957595 | Systems and methods for precision fabrication of an orifice within an integrated circuit | — | 2021-03-23 |
| 10923456 | Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die | — | 2021-02-16 |
| 10923412 | Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion | — | 2021-02-16 |
| 10892244 | Apparatus and method for securing substrates with varying coefficients of thermal expansion | — | 2021-01-12 |
| 10840216 | Systems and methods for powering an integrated circuit having multiple interconnected die | — | 2020-11-17 |
| 10784128 | Apparatus and method for securing components of an integrated circuit | Frank Jun, Paul Kennedy | 2020-09-22 |
| 10776222 | Asymmetric memory transceiver | — | 2020-09-15 |
| 10777532 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2020-09-15 |
| 10672732 | Apparatus and method for securing substrates with varying coefficients of thermal expansion | — | 2020-06-02 |
| 10586784 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2020-03-10 |
| 10468369 | Apparatus and method for securing substrates with varying coefficients of thermal expansion | — | 2019-11-05 |
| 10453717 | Apparatus and method for securing components of an integrated circuit | Frank Jun, Paul Kennedy | 2019-10-22 |
| 10440860 | Thermal management via active surfaces | — | 2019-10-08 |
| 10366967 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2019-07-30 |
| 10361172 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2019-07-23 |
| 10332860 | Apparatus and method for multi-die interconnection | Philip Ferolito | 2019-06-25 |
| 10321586 | Modular solid-state storage system | — | 2019-06-11 |
| 10242891 | Apparatus and method for securing components of an integrated circuit | Frank Jun, Paul Kennedy | 2019-03-26 |