Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11927799 | Data transmission system and data transmission method | Po-Kuan Shen, Chiu-Lin Yu, Kai Han, Jenq-Yang Chang, Mao-Jen Wu +1 more | 2024-03-12 |
| 11558117 | Wireless radio frequency conversion system | Po-Kuan Shen, Sheng-Fu Lin, Yu-Chun Wang, Kai Han, Jenq-Yang Chang +1 more | 2023-01-17 |
| 11509400 | Image transmission system and image transmission method | Po-Kuan Shen, Chao Chieh Hsu, Chiu-Lin Yu, Kai Han, Sheng-Fu Lin +2 more | 2022-11-22 |
| 11493711 | Hybrid multi-layered optical flexible printed circuit device and manufacturing method thereof | Po-Kuan Shen, Chao Chieh Hsu, Sheng-Fu Lin, Chiu-Lin Yu, Kai Han +2 more | 2022-11-08 |
| 11009788 | Method for manufacturing optical electrical module and substrate of an optical electrical module | Shang-Jen Yu | 2021-05-18 |
| 9923103 | Detachable package structure | Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh | 2018-03-20 |
| 9488791 | Optoelectronic module | Chia-Chi Chang, Guan-Fu Lu | 2016-11-08 |
| 9064988 | Photoelectric device package | Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh | 2015-06-23 |
| 9057850 | Optoelectronic module | Chia-Chi Chang, Guan-Fu Lu | 2015-06-16 |
| 8940563 | Method for manufacturing optoelectronic module | Shang-Jen Yu, Chien-Chen Hsieh | 2015-01-27 |
| 8580589 | Wafer-level process for fabricating photoelectric modules | Hsu-Liang Hsiao, Guan-Fu Lu | 2013-11-12 |
| 8138509 | Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate | Tzy-Ying Lin, Wu-Cheng Kuo | 2012-03-20 |