Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11680193 | Low-temperature heat-curable adhesive composition for structure | Daisuke Makino, Atsuhiko SUZUKI, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto | 2023-06-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11680193 | Low-temperature heat-curable adhesive composition for structure | Daisuke Makino, Atsuhiko SUZUKI, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto | 2023-06-20 |