Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398961 | Heat exchanger device having a partially deformable heated surface | George Anthony Meyer, IV | 2025-08-26 |
| 11493280 | Heat pipe module and heat dissipating device using the same | Te-Hsuan Chin | 2022-11-08 |
| 11313628 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2022-04-26 |
| 11092386 | Manufacturing method and structure of heat pipe with adjustable working temperature range | George Anthony Meyer, IV | 2021-08-17 |
| 10982906 | Heat pipe with non-condensable gas | George Anthony Meyer, IV | 2021-04-20 |
| 10935326 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2021-03-02 |
| 10876798 | Anti-gravity heat pipe device | Tzu-Wei Gu | 2020-12-29 |
| 10697710 | Manufacturing method of three-dimensional heat conducting structure | Lei Liu | 2020-06-30 |
| 10571201 | Heat pipe with non-condensable gas | George Anthony Meyer, IV | 2020-02-25 |
| 10410954 | Cooling module, water-cooled cooling module and cooling system | Lei Liu | 2019-09-10 |
| 10378828 | Anti-gravity heat pipe device | Tzu-Wei Gu | 2019-08-13 |
| 10371458 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2019-08-06 |
| 10345049 | Communication-type thermal conduction device | Leilei Liu, Xiao Min ZHANG | 2019-07-09 |
| 10126069 | Three-dimensional heat transfer device | Lei Liu, Xiaomin Zhang | 2018-11-13 |
| 10077946 | Three-dimensional heat conducting structure and manufacturing method thereof | Lei Liu | 2018-09-18 |
| 9939205 | Heat dissipater having capillary component | Lei Liu, Xiao Min ZHANG | 2018-04-10 |
| 9721869 | Heat sink structure with heat exchange mechanism | — | 2017-08-01 |
| 9702635 | Loop heat pipe structure with liquid and vapor separation | — | 2017-07-11 |
| 9533385 | Flat heat pipe and method of manufacturing the same | Chun Zhou | 2017-01-03 |
| 8792238 | Heat-dissipating module having loop-type vapor chamber | George Anthony Meyer, IV, Chieh-Ping Chen, Yung-Tai Lu, Ming-Kuei Hsieh | 2014-07-29 |
| 8134834 | Clamp-type heat sink for memory | George Anthony Meyer, IV, Chieh-Ping Chen, Hsien-Tsang Liu | 2012-03-13 |
| 8059406 | Heat sink for memory and memory device having heat sink | George Anthony Meyer, IV, Chieh-Ping Chen, Hsien-Tsang Liu | 2011-11-15 |
| 8011361 | Solar power system with tower type heat dissipating structure | George Anthony Meyer, IV, Chieh-Ping Chen | 2011-09-06 |
| 7875900 | Thermally conductive structure of LED and manufacturing method thereof | George Anthony Meyer, IV, Chieh-Ping Chen | 2011-01-25 |
| 7684187 | Heat dissipation device | George Anthony Meyer, IV | 2010-03-23 |