Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4720424 | Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating | Nancy C. Eickman, Gary E. Williams, Hyun-Nam Yoon | 1988-01-19 |
| 4719250 | Encapsulation of electronic components | Nancy C. Eickman, Gary E. Williams, Hyun-Nam Yoon | 1988-01-12 |
| 4632798 | Encapsulation of electronic components with anisotropic thermoplastic polymers | Nancy C. Eickman, Gary E. Williams, Hyun-Nam Yoon | 1986-12-30 |
| 4554328 | Modified PET polymers and copolymers suitable for extrusion blow molding | Stephen M. Sinker, Joseph J. Baron, Jr., Raymond W. Rupp, Marvin L. Doerr | 1985-11-19 |
| 4554329 | Modified PET polymers and copolymers suitable for extrusion blow molding | Stephen M. Sinker | 1985-11-19 |