JR

Jamie Rieg

CL Ccl Label: 2 patents #47 of 190Top 25%
Overall (All Time): #1,942,945 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10356913 High speed solder deposition and reflow for a printed flexible electronic medium Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek 2019-07-16
10064289 High speed solder deposition and reflow for a printed flexible electronic medium Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek 2018-08-28