Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10356913 | High speed solder deposition and reflow for a printed flexible electronic medium | Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek | 2019-07-16 |
| 10064289 | High speed solder deposition and reflow for a printed flexible electronic medium | Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek | 2018-08-28 |