Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10152621 | Identification of miniaturized electronic assembly using identification features on multiple components | Alok Sharan | 2018-12-11 |
| 9119317 | Method of folding flexible substrate in-situ using fold-assisting frame | — | 2015-08-25 |
| 8981546 | Semiconductor package | Adam Birge, Kevin John Pickup | 2015-03-17 |
| 7982487 | System for multiple layer printed circuit board misregistration testing | Orrin P. Lorenz, Howard Bentley | 2011-07-19 |
| 7617598 | Method of making a thermally isolated via structure | Steven P. Findell | 2009-11-17 |
| 7619434 | System for multiple layer printed circuit board misregistration testing | Orrin P. Lorenz, Howard Bentley | 2009-11-17 |
| 7497911 | Flip chip die assembly using thin flexible substrates | Vijesh Unnikrishnan, David J. Smith | 2009-03-03 |
| 7388394 | Multiple layer printed circuit board having misregistration testing pattern | Orrin P. Lorenz, Howard Bentley | 2008-06-17 |
| 7226821 | Flip chip die assembly using thin flexible substrates | Vijesh Unnikrishnan, David J. Smith | 2007-06-05 |
| 7205486 | Thermally isolated via structure | Steven P. Findell | 2007-04-17 |