Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916038 | Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device | Takayuki Saitoh, Takehito Shimatsu, Miyuki UOMOTO | 2024-02-27 |
| 11784030 | Plasma processing apparatus | Atsushi Takeda, Tadashi Inoue, Masaharu Tanabe, Kazunari Sekiya, Hiroshi Sasamoto +2 more | 2023-10-10 |
| 11600469 | Plasma processing apparatus | Atsushi Takeda, Tadashi Inoue, Masaharu Tanabe, Kazunari Sekiya, Hiroshi Sasamoto +2 more | 2023-03-07 |
| 11450643 | Chemical bonding method and joined structure | Takehito Shimatsu, Miyuki UOMOTO, Kazuo Miyamoto, Yoshikazu Miyamoto, Nobuhiko KATOH +1 more | 2022-09-20 |
| 7744706 | Solder alloy for bonding oxide material, and solder joint using the same | Minoru Yamada, Nobuhiko Chiwata | 2010-06-29 |