Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5302798 | Method of forming a hole with a laser and an apparatus for forming a hole with a laser | Hideo Inagawa, Tohru Ohsaka | 1994-04-12 |
| 5215593 | Method of introducing liquid into small-diameter hole | Hideho Inagawa, Tohru Ohsaka | 1993-06-01 |
| 5166493 | Apparatus and method of boring using laser | Hideho Inagawa | 1992-11-24 |
| 5126532 | Apparatus and method of boring using laser | Hideho Inagawa | 1992-06-30 |
| 5073687 | Method and apparatus for working print board by laser | Hideho Inagawa | 1991-12-17 |
| 5063280 | Method and apparatus for forming holes into printed circuit board | Hideho Inagawa | 1991-11-05 |