| 10831235 |
Electronic module and imaging system |
Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu +2 more |
2020-11-10 |
| 10735673 |
Imaging device module, imaging system, imaging device package, and manufacturing method |
Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Satoru Hamasaki +1 more |
2020-08-04 |
| 9815133 |
Method for producing a module |
Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Shin Hasegawa |
2017-11-14 |
| 9774769 |
Mounted electronic component including connection portions |
Takanori Suzuki, Koji Tsuduki, Yasushi Kurihara |
2017-09-26 |
| 9253922 |
Electronic component and electronic apparatus |
Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa +3 more |
2016-02-02 |
| 9220172 |
Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus |
Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa +2 more |
2015-12-22 |
| 9155212 |
Electronic component, mounting member, electronic apparatus, and their manufacturing methods |
Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa +2 more |
2015-10-06 |
| 8698938 |
Solid-state imaging apparatus, method of manufacturing same, and camera |
Koji Tsuduki, Takanori Suzuki, Satoru Hamasaki |
2014-04-15 |
| 8279336 |
Solid-state image pickup device |
Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki |
2012-10-02 |
| 8241951 |
Method of manufacturing solid-state image pickup device and solid-state image pickup device |
Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki |
2012-08-14 |
| 6383835 |
IC package having a conductive material at least partially filling a recess |
Fumio Hata, Tadashi Kosaka |
2002-05-07 |
