Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5464653 | Method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board | Marta Zorilla | 1995-11-07 |
| 5231757 | Method for forming the multi-layer structure of a connection board of at least one very large scale integrated circuit | Marta Zorrilla | 1993-08-03 |
| 5082718 | Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit | Marta Zorrilla | 1992-01-21 |
| 4906592 | Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer | Pierre Merenda, Daniel James Lambert | 1990-03-06 |
| 4826786 | Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby | Pierre Merenda, Daniel James Lambert | 1989-05-02 |