Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6056186 | Method for bonding a ceramic to a metal with a copper-containing shim | Lee B. Max, Jeffrey Karker | 2000-05-02 |
| 5760473 | Semiconductor package having a eutectic bonding layer | Lee B. Max | 1998-06-02 |
| 5243843 | Thread forming method and apparatus | — | 1993-09-14 |
| 5182937 | Seam-free thread rolling dies | — | 1993-02-02 |
| 4563890 | Cut-off style, roll thread flat dies | — | 1986-01-14 |
| 4563383 | Direct bond copper ceramic substrate for electronic applications | James E. Kuneman | 1986-01-07 |