Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11155088 | Liquid ejection head | Masaaki Deguchi | 2021-10-26 |
| 11130336 | Liquid ejection head | Masaaki Deguchi | 2021-09-28 |
| 10960668 | Liquid discharge head and liquid discharge apparatus | — | 2021-03-30 |
| 10944042 | Piezoelectric actuator and method for manufacturing piezoelectric actuator | — | 2021-03-09 |
| 10864735 | Liquid ejection head | Masaaki Deguchi | 2020-12-15 |
| 10857796 | Liquid ejection head and liquid ejection device | — | 2020-12-08 |
| 10377138 | Method for producing liquid discharge apparatus | Taiki Tanaka | 2019-08-13 |
| 10205086 | Piezoelectric actuator and method for manufacturing piezoelectric actuator | — | 2019-02-12 |
| 9610771 | Liquid discharge apparatus and method for producing the same | Taiki Tanaka | 2017-04-04 |
| 9340025 | Method for producing liquid discharge apparatus, liquid discharge apparatus, and method for forming liquid repellent layer | Tomoko Hibino | 2016-05-17 |
| 7030498 | Semiconductor device with copper wirings having improved negative bias temperature instability (NBTI) | Yoshihiro Takao | 2006-04-18 |
| 6885105 | Semiconductor device with copper wirings | Yoshihiro Takao | 2005-04-26 |
| 6878619 | Method for fabricating semiconductor device | — | 2005-04-12 |
| 6794693 | Semiconductor device and manufacturing method thereof | Atsushi Suzuki, Kiyotaka Tabuchi | 2004-09-21 |
| 6777323 | Lamination structure with copper wiring and its manufacture method | — | 2004-08-17 |
| 6455444 | Semiconductor device having a multilayer interconnection structure | — | 2002-09-24 |
| 6211570 | Semiconductor device having a multilayer interconnection structure | — | 2001-04-03 |