Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324697 | Chip-on-heatsink light emitting diode package and fabrication method | Chao-Kun Lin | 2016-04-26 |
| 9142743 | High temperature gold-free wafer bonding for light emitting diodes | Chih-Wei Chuang, Chao-Kun Lin, Long Yang | 2015-09-22 |
| 8455332 | Method and apparatus for manufacturing LED devices using laser scribing | Ghulam Hasnain | 2013-06-04 |
| 8324636 | Method and apparatus for manufacturing LED devices using laser scribing | Ghulam Hasnain | 2012-12-04 |