MT

Michel Hendrikus Lambertus Teunissen

BB Besi Netherlands B.V.: 2 patents #7 of 16Top 45%
FB Fico B.V.: 1 patents #11 of 31Top 40%
📍 Herwen, NL: #2 of 5 inventorsTop 40%
Overall (All Time): #1,454,103 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10720340 Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components 2020-07-21
10032653 Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components 2018-07-24
7608486 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier Martin Herman Weggen, Wilhelmus Gerardus Jozef Gal 2009-10-27