Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426143 | Moulded part and flexible film with a protected printed conductor, and method for producing the same | Jochen Voss, Friedrich Jonas | 2002-07-30 |
| 5935405 | Process for producing rigid and flexible circuits | Friedrich Jonas | 1999-08-10 |
| 5888372 | Process for producing metal-coated films in web form | Louis Bollens, Andre Heyvaerts, Dirk Quintens, Henning Giesecke, Friedrich Jonas | 1999-03-30 |
| 5575898 | Process for through-hole plating of two-layer printed circuit boards and multilayers | Friedrich Jonas, Reinhard Schomacker | 1996-11-19 |
| 5436034 | Process for improving the adhesiveness of electrolessly deposited metal films | Henning Giesecke, Wilfried Haese | 1995-07-25 |
| 5403467 | Process for through-hole plating of two-layer circuit boards and multilayers | Friedrich Jonas | 1995-04-04 |
| 5378268 | Primer for the metallization of substrate surfaces | Kirkor Sirinyan, Wolfgang Henning, Rudolf Merten, Ulrich V. Gizycki, Bruce Benda | 1995-01-03 |
| 5300140 | Hydroprimer for metallising substrate surfaces | Ulrich von Gizycki, Wolfgang Cohnen, Gunther Reichert, Gert Jabs | 1994-04-05 |
| 5296020 | Formulation for the activation of substrate surfaces for currentless metallization thereof | Gunther Reichert, Frank Kobelka, Ulrich von Gizycki | 1994-03-22 |
| 5233753 | Method of making injection-moulded printed circuit boards | Henning Giesecke, Joachim Wank | 1993-08-10 |
| 5200272 | Process for metallizing substrate surfaces | Kirkor Sirinyan, Reinhold Dederichs, Rudolf Merten, Ulrich von Gizycki, John L. Williams | 1993-04-06 |
| 5182135 | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces | Henning Giesecke, Hanns P. Muller, Ulrich von Gizycki, Martin Wienkenhover | 1993-01-26 |
| 5176743 | Formulation of activating substrate surfaces for their electroless metallization | Gunther Reichert, Henning Giesecke | 1993-01-05 |
| 4913768 | Process for producing electrical conductor boards | Kirkor Sirinyan, Ulrich von Gizycki, Rudolf Merten, Friedrich H. Langer | 1990-04-03 |
| 4910045 | Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces | Henning Giesecke, Wilfried Zecher | 1990-03-20 |
| 4847139 | Flexible circuits | Kirkor Sirinyan, Ulrich von Gizycki, Rudolf Merten | 1989-07-11 |
| 4832989 | Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces | Henning Giesecke, Joachim Probst, Klaus Schuster | 1989-05-23 |
| 4830714 | Process for the production of printed circuit boards | Kirkor Sirinyan, Ulrich von Gizycki, Rudolf Merten | 1989-05-16 |
| 4804475 | Metallized membrane systems | Kirkor Sirinyan, Karlheinz Hildenbrand, Ulrich von Gizycki, Rudolf Merten, Hermann Perrey | 1989-02-14 |
| 4764401 | Process for activating substrate surfaces for electroless metallization | Kirkor Sirinyan, Henning Giesecke, Harold Ebneth, Rudolf Merten | 1988-08-16 |
| 4753821 | Process for the partial metallization of substrate surfaces | Henning Giesecke, Ulrich von Gizycki, Reinhart Matejek | 1988-06-28 |
| 4728560 | Electrical printed circuit boards | Kirkor Sirinyan, Ulrich von Gizycki, Rudolf Merten | 1988-03-01 |
| 4661384 | Process for activating substrate surfaces for electroless metallization | Kirkor Sirinyan, Rudolf Merten | 1987-04-28 |
| 4636441 | Semi-finished products for the manufacture of printed circuit boards | Kirkor Sirinyan, Ulrich von Gizycki, Rudolf Merten | 1987-01-13 |
| 4622411 | Organopalladium-II-complex compounds | Kirkor Sirinyan, Henning Giesecke, Harold Ebneth, Rudolf Merten | 1986-11-11 |