Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11187073 | Method and apparatus for bending decoupled electronics packaging | Joachim Treviranus, Tim Mueller, Andreas Peter | 2021-11-30 |
| 10753517 | Tubular connecting arrangement and method of sealingly connecting tubulars | Stephan Mueller, Andreas Herbel | 2020-08-25 |
| 10738591 | Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies | Andreas Peter, Michell Schimanski, Christian Preiser | 2020-08-11 |
| 10480251 | Expandable downhole tool assemblies, bottom-hole assemblies, and related methods | Steven R. Radford, Marcus Oesterberg, Khoi Q. Trinh, Timothy Miller, Shyam Anandampillai +6 more | 2019-11-19 |
| 10066768 | Tubular connecting arrangement and method of sealingly connecting tubulars | Stephan Mueller, Andreas Herbel | 2018-09-04 |
| 10036206 | Expandable reamer assemblies, bottom hole assemblies, and related methods | Steven R. Radford, Marcus Oesterberg, Khoi Q. Trinh, Timothy Miller, Shyam Anandampillai +6 more | 2018-07-31 |
| 9976404 | Downhole tool including a multi-chip module housing | Stephan Mueller, Hans Oppelaar, Robert Buda, Henning Rahn, Ingo Roders +1 more | 2018-05-22 |
| 9920617 | Removeable electronic component access member for a downhole system | Stephan Mueller, Hans Oppelaar, Henning Rahn, Robert Buda, Ingo Roders +1 more | 2018-03-20 |
| 9546546 | Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies | Andreas Peter, Michell Schimanski, Christian Preiser | 2017-01-17 |
| 9341027 | Expandable reamer assemblies, bottom-hole assemblies, and related methods | Steven R. Radford, Marcus Oesterberg, Khoi Q. Trinh, Timothy Miller, Shyam Anandampillai +6 more | 2016-05-17 |