Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10897824 | Encapsulation of downhole microelectronics and method the same | Zhenzhen Shen | 2021-01-19 |
| 10808519 | Electrical assembly substrates for downhole use | Zhenzhen Shen | 2020-10-20 |