Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261232 | Ultraviolet sensors and methods using integrated silicon carbide lateral junction field-effect transistors | James A. Holmes, Anthony M. Francis, Matthew Barlow, Sonia M. Perez | 2025-03-25 |
| 12256493 | Rapid implementation of high-temperature analog interface electronics | Ian Getreu, James A. Holmes, Brandon Dyer, Jacob Kupernik, Matthew Barlow +1 more | 2025-03-18 |
| 11723154 | Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package | A. Matthew Francis, Matthew Barlow, Jacob Kupernik | 2023-08-08 |
| 11647582 | Rapid implementation of high-temperature analog interface electronics | Ian Getreu, James A. Holmes, Brandon Dyer, Jacob Kupernik, Matthew Barlow +1 more | 2023-05-09 |
| 11217659 | Direct application additive manufacturing for conductive wafer interconnect | Matthew Barlow, Anthony M. Francis, James A. Holmes | 2022-01-04 |
| 10998890 | Radiation-hardened D flip-flop circuit | Bin Li, David Bostedo, Landon J. Caley, Patrick Fleming, David D. Moser | 2021-05-04 |