Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485671 | Inter-stage test structure for wireless communication apparatus | — | 2016-11-01 |
| 9373556 | Module IC package structure and method for manufacturing the same | — | 2016-06-21 |
| 9076801 | Module IC package structure | — | 2015-07-07 |
| 8874061 | Filtering apparatus and method for dual-band sensing circuit | Chung-Er Huang | 2014-10-28 |