Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8376209 | Non-destructive thermal conductivity detection of solder voids | Jae Hong Choi | 2013-02-19 |
| 7991214 | Method to enhance X-ray and optical images and locate nano-scale cracks in electric devices and components | Jae Hong Choi, James E. Evans, Matthew Gilhousen | 2011-08-02 |
| 7845849 | Testing BGA solder joints by localized pulsed-heat thermography | Jae Hong Choi | 2010-12-07 |
| 7570757 | Tilt mechanism for communication device | Jae Hong Choi, James E. Evans | 2009-08-04 |